SCM-3P Multi-point Pressure Grinding and Polishing Machine

Primarily used in the field of materials research. Suitable for automatic grinding and polishing of metal, ceramic, glass, rock, and ore samples, and can also be used for small-scale production in factories. This machine features high processing precision, stable and reliable performance, simple operation, and a wide range of applications. This machine is widely used in colleges and universities, research institutes, and production fields.

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Detailed description

Primarily used in the field of materials research. Suitable for automatic grinding and polishing of metal, ceramic, glass, rock, and ore samples, and also applicable for small-scale production in factories. This machine features high processing precision, stable and reliable performance, simple operation, and a wide range of applications. It is widely used in colleges and universities, research institutes, and production fields.

Main Technical Parameters

1. Polishing disc (lower disc) diameter: φ255mm

2. Polishing disc (lower disc) speed: 0-400rpm (incremental speed control, minimum increment 10)

3. Sample loading disc (upper disc) diameter: φ150mm Circular hole diameter: φ20mm (customizable)

4. Gravity sample loading disc diameter: φ80mm Repair ring: φ95mm

5. Polishing head spindle speed: 10-80rpm (stepless speed regulation), recommended range: 10-50rpm

6. Loading range: 0.5-20Kg (minimum increment 0.5Kg), recommended range: 0.5-15Kg

7. Power supply: 220V 50Hz

8. Dimensions: 660 ×460 ×760 mm

9. Weight: 95Kg

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